Earlier this month, Microchip Technology released its BZPACK mSiC power modules, engineered to exceed stringent HV-H3TRB ...

Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC ® power modules , designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The ...

Power modules handle heat, moisture, and high voltage while making design easier and reducing failures. Learn more about ...

Texas Instruments (TI) today unveiled new isolated power modules, helping enable increased power density, efficiency and ...

The unit measures 2 × 4 × 0.75 inches and delivers a power density of 33 W/in³, enabling significant miniaturization compared ...

Navitas Semiconductor has expanded its portfolio of SiCPAK power modules with new 1,200-V devices that feature epoxy-resin potting and proprietary trench-assisted planar SiC MOSFET technologies. These ...

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power.

Apex Microtechnology has announced the release of the MSA303, the latest member to its family of integrated power modules. The module utilizes silicon carbide MOSFET technology to improve efficiency ...

‘These technologies enter the market without proper qualification,’ Gebhardt says. Image: Fraunhofer ISE This interview appears alongside others on module reliability in the latest edition of our ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

ROHM Semiconductor today announced it has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules "HSDIP20", "DOT ...