SAN JOSE, Calif.--(BUSINESS WIRE)--Daeduck Electronics announced the successful development of a large body FCBGA substrate for AI servers and data centers. Established in 1965, Daeduck Electronics ...

Where ceramic packaging and substrates are employed. Why designing solutions with ceramic packaging and substrates is challenging. Ceramic packaging and substrates address high-performance and ...

Atomic force microscopy (AFM) shows the surface of the TaC thin film before and after annealing at high temperatures. The initial film surface is composed of many columnar grains, whereas after ...

Silicon nitride ceramic substrates play a pivotal role in Active Metal Brazing (AMB) substrates for power modules whose applications include inverters for electric vehicle (EV) and hybrid electric ...

Japan's Kyocera will be expanding its investment in equipment and R&D for semiconductors and electronic components for the next three fiscal years (2023/4-2026/3). The total capital spending will be ...