This technical FAQ examines three modeling gaps identified in engineering literature and outlines algorithmic methods to address them.

Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...

A growing body of neuroscience research is challenging a basic assumption about how the brain produces awareness. Where conventional theories treat consciousness as a product of neuronal firing alone, ...

To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an ...

The annual IEEE International Symposium on EMC, sponsored by the EMC Society often includes workshops on the basics of numerical modeling, plus technical sessions on the latest modeling developments.

SANTA CLARA, Calif.--(BUSINESS WIRE)--Helic, Inc. announced today that its electromagnetic (EM) modeling engine and RaptorX™ have been certified for GLOBALFOUNDRIES 22nm FD-SOI (22FDX®) process ...