TeraSignal Delivers Industry's First Intelligent Redriver for 200G+ Copper Interconnects

TeraSignal, a leader in intelligent interconnect technology today announced the TeraSignal TS5802, the world's most advanced analog equalizer, implemented in advanced ...
News Medical

Using CMOS Devices to Capture Cell Images

Complementary Metal Oxide Semiconductor (CMOS) is a type of circuit known to be cost-effective and efficient. These circuits are found in many day-to-day items, such as batteries and the image sensors ...
EDN

I2C-bus controlled low-power CMOS device that provides all the logic and control required to drive a four phase stepper motor

The PCA9629 is an I²C-bus controlled low-power CMOS device that provides all the logic and control required to drive a four phase stepper motor. PCA9629 is intended to be used with external high ...
EDN

CMOS most appropriate for 60-GHz mixers

The increasing popularity of the 60-GHz unlicensed band for wireless communications, combined with CMOS scaling yielding faster devices, offers a great opportunity for using mainstream CMOS technology ...
Nature

Vertical Hall Sensors and Devices in CMOS Technology

Vertical Hall sensors, integrated within standard CMOS processes, have emerged as versatile components for magnetic field measurements in a range of industrial and consumer applications. These devices ...
Business Wire

ams OSRAM Makes UV-A/B/C Radiation Monitoring More Affordable With Launch of New High-Sensitivity Three-Channel CMOS Sensor

PREMSTAETTEN, Austria--(BUSINESS WIRE)--ams OSRAM (SIX: AMS), a global leader in optical solutions, has introduced a three-channel UV-A/B/C sensor, the AS7331, which brings UV dosage and exposure ...
Electronic Design

Twisted Bonding Technology Speeds Up CMOS Devices

Improved bonding technology helped Toshiba and IBM Corp. develop a higher performance CMOS FET. CMOS has traditionally played a central role in semiconductor design, a position now under threat as ...
Semiconductor Engineering

The Specialty Device Surge, Part 1: Wafer Size Transitions Are Powering The Future Of Specialty Devices And Bringing New Challenges

Specialty devices are the unsung heroes of modern life. For many in the semiconductor industry today, the spotlight is on the SiC and GaN power devices used in automotive, green energy, fast-charge ...
Electronic Design

Imec Demonstrates III-V Compound FinFET Devices

November 9, 2013. Imec announced that it has successfully demonstrated the first III-V compound semiconductor FinFET devices integrated epitaxially on 300-mm silicon wafers, through a unique silicon ...
ExtremeTech

With Spintronics, Intel Sees Efficiency, Density Scaling Far Beyond CMOS

Conventional CMOS scaling has entered a state of terminal decline. That's the bottom-line takeaway, when you cut through the marketing spiel from companies and look at the expected improvements ...