Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...

A technology for the three-dimensional integration of processing units and memory, as reported by researchers from Tokyo Tech, has achieved the highest attainable performance in the whole world, ...

Peek inside the package of AMD’s or Nvidia’s most advanced AI products and you’ll find a familiar arrangement: The GPU is flanked on two sides by high-bandwidth memory (HBM), the most advanced memory ...

Penn State researchers demonstrated 3D integration of semiconductors at a massive scale, characterizing tens of thousands of devices using 2D transistors made with 2D semiconductors, enabling ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...

3D integrated circuits promise smaller, faster devices with lower power consumption. Vertically stacked 3D integrated circuits also enable novel in-memory and in-sensor computing paradigms and ...

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

Successive versions of vertical transistors are emerging as the likely successor to finFETs, combining lower leakage with significant area reduction. A stacked nanosheet transistor, introduced at N3, ...

Engineers suggest a way to fit more transistors on a chip by seamlessly implementing 3D integration with 2D materials. Moore's Law, a fundamental scaling principle for electronic devices, forecasts ...